Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

11/3/10

Sandy Bridge Intel Xuan Mito comprehensive tour shows

San Francisco, the first day of Fall IDF 2010, Intel is better overall picture of the expectations of the next-generation processor family, "Sandy Bridge", and first published a large number of in-depth technical details and fine wafer Photos

Intel Vice President and General Manager of Architecture Group Dadi Perlmutter said: "the way people use computers is the speed of evolution of an explosive, an urgent need for more powerful, more visual expression of the experience. Our upcoming second-generation Intel Core processing device family represents the computing performance and capabilities of the most significant progress Dell Studio 1735 battery. In addition to Intel notebook platforms provide these features, we also plan to extend to the data center server and embedded computing product line. "

Sandy Bridge will be the official name of the series "2011 the second generation Intel Core processor family" (2011 2nd Generation Intel Core processor family), known as the first new Intel-based "Visibly Smart" micro-architecture, using 32nm process and the second generation of high-K metal gate (HKMG) technology, which integrates about 10 billion transistors.

Sandy Bridge family will continue to use Core i7, Core i5, Core i3 by way of Dell Studio 17 battery sub-series, and again replaced with new LOGO ID:

Sandy Bridge family, the main technical highlights include:

- The next generation Turbo Boost (Turbo) Dynamic Acceleration Technology:

According to instructions on the type of operation dynamically adjust CPU, GPU frequency to achieve maximum performance or energy consumption, and to add new power balancing algorithm, manage power consumption and heat dissipation, optimizing performance.

- Improved the core of the ring interconnection and innovation:

Significantly improved the core, and a revolutionary interconnect to better connect the ring to improve data bandwidth, performance and energy efficiency. Ring interconnect is a high-bandwidth, low latency of the integrated module, closely connected computing core CPU Dell Studio 1735 battery, GPU graphics core and other modules (Display, I / O, system assistant, memory controller, etc.), provide high-speed low-latency communications.

- The industry's first implementation of the pipeline with new graphics core:

The sixth generation of integrated graphics core, the same 32nm HKMG technology to support high-definition video, stereo 3D, mainstream games, multitasking, social networking, multimedia and more. CPU core and GPU core of shared system resources such as three-level cache to optimize performance and reduce power consumption.

Non-official statement, the new set was also full support for DX11.

Intel also unveiled a new site architecture transcoding hardware acceleration performance, including high-definition video encoding and decoding. Use CyberLink MediaEspresso to a minute long, 30Mbps bit rate 1080p Full HD video into iPhone-compatible format, Sandy Bridge takes less than ten seconds.

- Desktop Low power consumption:

Including performance optimization 65W (thermal design power) version, power optimization of the 45/35W version, etc., are shipped through special authorized dealers Intel boxed version, with a new half-high small radiator at the same time Intel has also invested a small Mini-ITX specification standardized the desktop motherboard and chassis, for one machine system.

- Desktop Integration and Innovation Programme:

Foxconn, Mitac have demonstrated thin-one desktop, and use a specially designed Intel's "Buffalo Bay" motherboard and power supply. Acer systems are based on 65W Core i7 processor.

- The next generation of Sandy Bridge Xeon processors:

Also based on the Sandy Bridge architecture for two-way server and workstation market, a single processor, up to 8 cores, 16 threads, will be put into the second half of 2011.

Intel CEO Paul Otellini unveiled a new Xeon server site Vidyo video conferencing software to run the case, all running 32 threads Dell Studio 17 battery, and also uses the new AESNI instruction set.

In addition, there Westmere-EX Xeon processors Dell Studio 1735 battery, Nehalem-EX is compatible successor to, 32nm process, up to 10 cores, 20 threads, memory support doubled to 32GB (system total 2TB), security enhancements.

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3/24/10

Sony, Intel andGoogle co-develop next-generation TV

March 18 message, "New York Times" (New YorkTimes) reported today that Internet giant Google (Google) has been and Intel (Intel) and Sony VGP-BPS8 (Sony) hand in hand, ready to develop GoogleTV platform for the network into the next generation of television and Digital set-top box system.

Reported that Google has developed a prototype set-top boxes, but the networking features such integration technology can also be directly built into the TV or Blu-ray players and other devices. The television technology, built on Google's Android open mobile operating system platform to Intel's Atom chips VGP-BPS9.

Google TV software will provide users with new television interface, so that they can use Web search can also watch YouTube, Laptop battery and other videos.

Games and social networking sites can also operate on this system.

The scheme has been carried out for several months, but the company does not comment one is willing to come forward.


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12/28/09

AMD is expected to release three-core notebook platform in May next year



Digital News:


Intel launched a new Pine Trail platform, AMD will not fall behind and release the platform called "Danube" (Danube), as opposed to the use of Pine Trail is for Netbook, while the Danube is to mainstream notebook platform.

More noteworthy place in the AMD in the mobile platform, there will be three-core CPU, but also the Black Box (Black Edition, no locks multiplier any case, ASUS has Turbo33 a), but in order to save power and volume, they are removed in the L3 memory. Northbridge is still using the previous generation Tigris platform M880G (or RS880M), if the non-independent graphics version of the GPU is a ATi Radeon 4200, while the South Bridge is used SB820M.

Can be summed up from the table, X at the beginning of the TDP is 45W, N is 35W, while the P is 25W, and are based on 45nm process, which is expected to market in May 2010.

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12/18/09

Intel plans to launch 17 microprocessor next January

It news:

December 18, according to foreign reports, Intel plans to launch CES Consumer Electronics Show which introduces 17 microprocessors on a chip, it was the first time for the company to achieve the manufacturing technology- the latest achievements of 32 nm.


The 17 models will use the Core Duo chip brand, they are all based on a design technique known as Nehalem.


The adoption of the technology makes the performance of Intel's high-end chips be improved in the past year. The use of the chip size from 45 nm is reduced to 32 nm production process, more functionality can be concentrated in a smaller space inside, thus reducing production costs. Intel plans to let the mainstream desktop and laptop computers also enjoy the benefits of lower costs and prices , and provide consumers with a wide selection space.


On January 7 it will hold pre-CES product launches, Intel will not be disclosed the outside world most of the details, such as the pricing of the new chip, and which PC makers will use these chips.

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11/19/09

AMD settled with Intel

IT news:

Intel had 6 “not allowed"

According to foreign media reports, Intel and AMD anti-trust settlement reached, the provisions of the agreement, Intel must comply with six major business criteria.

Last Thursday, Intel reached a settlement with the AMD and Intel will pay AMD 1.25 billion U.S. dollars, so as to solve all the anti-trust between the two sides and patent infringement litigation.

As part of the settlement agreement, Intel agreed to comply with a range of business codes of conduct, but both the two sides did not disclose the specific content of those standards of conduct.

Recently the U.S. Securities and Exchange Commission (SEC) K8 documents show that Intel is subject to the 6 which are not allowed:

1. Intel can not provide any benefits to customers in exchange for customer agreements, and commit to purchase only Intel processors.

2. Intel can not provide any benefits to customers in exchange for customer agreements, commitments to limit or postpone the purchase of AMD processors.

3. Intel is not providing any benefits to customers in exchange for customer agreements, a commitment to limit the promotion, production or distribution of the use of AMD PC processor.

4. Intel is not providing any benefits to customers in exchange for customer agreement, promise to give up or delay to participate in AMD's product releases, advertising or other promotional activities.

5. Intel, retailers or distributors are not allowed to provide any benefit to asking them to limit or postpone the purchase or distribution of AMD processor-based PC, or other platforms.

6. Who do not meet Intel's limited manufacturers and Intel may not be threatened.

According to the agreement, the above six restriction period for Intel for 10 years.

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